CoreTechnologie Updates 3D_Analyzer CoreTechnologie Updates 3D_Analyzer…

3D_Analyzer is a 3D analysis and viewer for analysis for analyzing wall thicknesses, undercuts, draft analysis in complex plastic parts.…
ANSYS 18.1 Boosts Design Productivity and Optimization ANSYS 18.1 Boosts Design Productivity and Optimization…

ANSYS 18.1 has added new capabilities within its topology optimization and adds new significant capabilities in the electromagnetics suite.…
Top 10 Reasons to Use EZtol Instead of Spreadsheets…

Sigmetrix is previewing its new EZtol 1-D tolerance stackup analysis software, which makes it easier to create and manage multiple…
ASSESS 2017 Announced at COFES ASSESS 2017 Announced at COFES…

Cyon Research and IntrinSIM's Analysis, Simulation, and Systems Engineering Software (ASSESS) event will take place this November in Maryland.…
 

Webinar On Electronics Cooling Simulation in ANSYS 18
Webinar On Electronics Cooling Simulation in ANSYS 18…

This webinar covers importing chip thermal models (CTM) from ANSYS RedHawk to ANSYS Icepak for thermal analysis of the complete…
 
Got 20 Minutes? See ANSYS AIM in Action Got 20 Minutes? See ANSYS AIM in Action…

If you're a design engineer hesitant to learn engineering simulation software then this short session is for you. See how…
 
Print BOM from Sheet Metal Part
How do I print the BOM from the flat panel dimensions of a sheet metal part? Source: 3DCADForums…
 
Add a Round Rubber Seal to a Groove
How do I set the mates for a round rubber seal I wish to add to a groove? Source: ENG-Tips.com…
 
Sharing ILogic Files
What is the best practice for sharing ILOGIC files? Source: Autodesk Forums…
 
Inventor 2016 mould modeling
I'm trying to do some modeling which involves a set angle on vertical faces. This is because I am trying…
 
 
Is the New PLM Right for You? Surveys Reveal All
 
CAD Data Exchange & Collaboration 2015
 
 
 
Get Your CAD File Ready for Autodesk Simulation Tools…
Automated geometry simplification tools from Autodesk make it easy to allow well documented CAD to be ready for simulation tools.…
 
Direct Edit Capabilities in Autodesk Inventor 2015…
Autodesk Inventor 2015 introduces a new method for editing imported solid data called "Direct Edit."…
 
Sending SIM 360 Pro and Autodesk Vault Files to the…
This tip explains what to do when SIM 360 Pro and Autodesk Vault users encounter a 'could not connect to…
 
STAR-CCM+ Predicts Performance with Digital Twin STAR-CCM+ Predicts Performance with Digital Twin…

STAR-CCM+ v12.02 introduces Ray Tracing and a new Adaptive Gridding capability for combustion tables and multi-component gas/liquid species.…
 
Hexagon Completes Acquisition of MSC Software Hexagon Completes Acquisition of MSC Software…

CAE provider MSC has over 1,200 highly-skilled professionals in 20 countries and is used by industries such as automotive, aerospace…
 
Project Calrissian for CFD Extended to March Project Calrissian for CFD Extended to March…

This free technology preview features functionality from Autodesk Flow Design including solver optimizations, lift and drag charts, and more.…
 
 
Siemens Has Announced Plans to Acquire Mentor Graphics Siemens Has Announced Plans to Acquire Mentor Graphics…

Siemens to expand its digital industrial leadership with acquisition of Mentor Graphics. Learn more in the recorded conference call.…
PLM technology Opens Beta for Managing Abaqus Tokens PLM technology Opens Beta for Managing Abaqus Tokens…

The Script: Flexnet Real-Time Monitor is a tool aimed at managing Abaqus Tokens by providing real-time statistics. Sign up for…
Latest COMSOL Releases Features Major Performance Increases Latest COMSOL Releases Features Major Performance Increases…

COMSOL announced updates for COMSOL Multiphysics software, COMSOL Server product, and COMSOL Client at its 12th annual COMSOL Conference.…
Join Us for Integrating Simulation and Process in PDM-PLM Join Us for Integrating Simulation and Process in PDM-PLM…

On September 27 join Autodesk and ESTECO for a PLM Roundtable and Webinar on integrating simulation and processes into PDM…
What's New in ESTECO modeFRONTIER 2016? What's New in ESTECO modeFRONTIER 2016?…

modeFRONTIER 2016 enables multidisciplinary engineering practices to easily share engineering and simulation data.…
KRONOS 800 Series Outperforms Competition in Benchmark KRONOS 800 Series Outperforms Competition in Benchmark…

The KRONOS workstation performs at extremely accelerated speeds, meeting challenges in engineering, 2D/ 3D CAD, rendering, and simulation.…
Updated Project Scandium for Moldflow Insight Updated Project Scandium for Moldflow Insight…

Available via Autodesk Labs, the simulation technology now has thermocouple-controlled cooling and autosizing for CAD and fiber improvements.…
What's in Store for Design Tech in 2017? ANSYS AIM Streamlines Shell and Tube Heat Exchanger Design…

ANSYS AIM provides all of the physical models and simulation tools needed to diagnose and optimize a heat exchanger within a…
 
ANSYS AIM Simplifies Simulation of LED Fixtures ANSYS AIM Simplifies Simulation of LED Fixtures…

Thermal management of LED fixtures can be complicated by the multiple physics involved. See how ANYS AIM can simplify this…
Democratizing Computational Fluid Dynamics Democratizing Computational Fluid Dynamics…

This paper looks at why CFD technology has a low uptake to being utilized by designers and has been reserved…
7 Tips to Increase Productivity by Frontloading CFD 7 Tips to Increase Productivity by Frontloading CFD…

Read this paper by Mentor to see how to achieve the full benefits of frontloading CFD, including a successful implementation…
ANSYS 18 Innovations - Signal Integrity, Power & EMI ANSYS 18 Innovations - Signal Integrity, Power & EMI…

In this webinar learn about enhancements for the Chip-Package-System workflow to address design challenges in power and signal integrity, and…
ANSYS AIM Streamlines Fatigue Analysis in a Single Interface ANSYS AIM Streamlines Fatigue Analysis in a Single Interface…

ANSYS AIM is an excellent tool for gas cylinder design because it integrates structural analysis, fatigue life prediction and parametric…
Democratizing Analysis with ANSYS Icepak Democratizing Analysis with ANSYS Icepak…

Traditionally the design engineer would have to pass the design to the mechanical/thermal engineer. ANSYS Iwave solves this issue.…
Electronic PCB and Package Thermal Stress Analysis Electronic PCB and Package Thermal Stress Analysis…

This paper explains the challenges and opportunities in preparing ECAD geometries for use with solvers associated with MCAD geometries.…
Chip-Package-System Analysis Techniques for Thermal Design Chip-Package-System Analysis Techniques for Thermal Design…

ANSYS' latest release (R17) adds significant improvements in the area of predicting thermal responses for system design early in the…
Accurately Predict Performance of Printed Circuit Boards Accurately Predict Performance of Printed Circuit Boards…

This paper presents a reference design flow for solving electrical, thermal and mechanical challenges of PCB's using simulation tools from…
Cummins' Analysis-led Design and Optimization Approach…
In this video Bob Tickel discusses how an optimization and analysis-led design approach enables the company to get products right the first time.
 
Achieving Simulation-driven Design with ANSYS 17.0…
CIMdata evaluates ANSYS to see if it is well positioned to provide comprehensive and high performance systems modeling and simulation capabilities.
 
Avalanches and Other Snow Modeled with CFD…
ANSYS provides examples on how teams around the world are successfully using CFD to simulate snow in different forms like snow fences and avalanches.
 
OESH Designs Innovative Shoes with Fusion 360…
Our Innovator of the Month is shoe company OESH, founded by a rogue academic who taught herself CAD and who uses Fusion 360 to design better shoes.
 
Who's Leading in GPU Shipments?…
Jon Peddie Research provides update on the hardware market from Q4 of 2014, with the average GPU market yielding below the ten-year average of 6.86%.
 
Introducing ANSYS 16.0…
Enhancements include features for connected electronic devices, simulating total spectrum of structural materials and enabling model-based systems.